Xenics SWIR

The Bobcat-320 is a small, high performance shortwave infrared camera. Its thermoelectric cooler ensures excellent low noise and low dark current characteristics.

The Bobcat-320 targets cost-sensitive volume markets such as laser beam analysis applications, sorting & recycling industry and investigation of defects inside silicon semiconductor material. This shortwave infrared camera comes with a CameraLink or GigE Vision interface and has a low weight, low power consumption and is small in size. 

With the Bobcat-320 SWIR camera you can look through glass, so the use of standard available C-Mount lenses and protective camera housings is no problem. Again making this infrared camera affordable for a wide variety of industrial applications. 

Array Specifications	Bobcat-320
Detector type	InGaAs
Spectral range	0.9 μm to 1.7 μm
Image format	320 (w) x 256 (h) pixels
Pixel pitch	20 μm
Array cooling	TE1-stabilized
Full well capacity	125 k e-
Pixel operability	> 99 %

 

Camera Specifications	Bobcat-320-CL	Bobcat-320-GigE
Lens	LWIR 18 mm F/1
Focal length	Broad selection of lenses available
Optical interface	C-mount
Imaging performance
Maximum frame rate (full frame)	100 Hz or 400 Hz
Min region size	Minimum size 32 x 4  (only for 400 Hz model)
Integration time range	1 µs to 40 ms
Dynamic range	61 dB
Analog-to-Digital (ADC)	14 bits
On-board image processing	Auto-Gain, Auto-Offset,  Auto-Exposure(for 400 Hz  CameraLink version)	Auto-Gain, Auto-Offset
Interfaces
Command and control	CameraLink	GigE Vision
Digital output format	14 bit CameraLink	14 bit GigE
Trigger	Trigger in or out (configurable)
Power requirements
Power consumption	2.8 W	4 W
Power supply	DC 12 V
Physical characteristics
Ambient operating temperature range	-40ºC to 70ºC
Dimensions (width x height x length)  - excluding lens (approximately)	55 x 55 x 72 mm	55 x 55 x 82 mm
Weight (excluding lens)	285 gr	334 gr

• High sensitivity
• Low NETD detector for high sensitivity
• 2 versions available
• Flexible and easy-to-use
• Ethernet standard interfaces
• Fast time to market with easy integration

• Food inspection
• Laser beam profiling
• Quality control and quality assurance
• Semiconductor inspection
• Thermal imaging of hot objects (300˚C to 800˚C range)
• Waste sorting